电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
ACT85610QX108-T

ACT85610QX108-T

ACT85610QX108

Qorvo

0 -
ACT85610QX108-T

数据表

- 52-VFQFN Exposed Pad Tape & Reel (TR) Active Solid State Drives (SSD) 4.1mA 2.7V ~ 14V -40°C ~ 150°C (TJ) - - Surface Mount 52-QFN (6x6)
MC33PF8200CLES

MC33PF8200CLES

IC POWER MANAGEMENT

NXP USA Inc.

0 -
MC33PF8200CLES

数据表

- 56-VFQFN Exposed Pad Tray Obsolete High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DAES

MC33PF8200DAES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DAES

数据表

- 56-VFQFN Exposed Pad Tray Obsolete High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DGES

MC33PF8200DGES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DGES

数据表

- 56-VFQFN Exposed Pad Tray Obsolete High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
BD71837MWV-E2

BD71837MWV-E2

SYSTEM PMIC FOR I.MX 8M FAMILY

Rohm Semiconductor

0 -
BD71837MWV-E2

数据表

- 68-VFQFN Exposed Pad Tape & Reel (TR) Active General Purpose 197µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount UQFN68CV8080
MCZ33800EK

MCZ33800EK

IC ENGINE CTRL SW/DVR 54-SOIC

NXP USA Inc.

0 -
MCZ33800EK

数据表

- 54-SSOP (0.295", 7.50mm Width) Exposed Pad Tube Active - 10mA 5V ~ 36V -40°C ~ 125°C Automotive - Surface Mount 54-SOIC-EP
LTC3566EUF#TRPBF

LTC3566EUF#TRPBF

IC USB POWER MANAGER 24-QFN

Analog Devices Inc.

0 -
LTC3566EUF#TRPBF

数据表

- 24-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices - 4.35V ~ 5.5V -40°C ~ 85°C - - Surface Mount 24-QFN (4x4)
LTC3566EUF-2#TRPBF

LTC3566EUF-2#TRPBF

IC POWER MANAGER USB 24-QFN

Analog Devices Inc.

0 -
LTC3566EUF-2#TRPBF

数据表

- 24-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices - 4.35V ~ 5.5V -40°C ~ 85°C - - Surface Mount 24-QFN (4x4)
LT3751IFE#TRPBF

LT3751IFE#TRPBF

IC CTRLR CAP CHARGER 20-TSSOP

Analog Devices Inc.

0 -
LT3751IFE#TRPBF

数据表

- 20-TSSOP (0.173", 4.40mm Width) Exposed Pad Tape & Reel (TR) Active Photoflash Capacitor Charger 5.5mA 4.75V ~ 24V -40°C ~ 125°C - - Surface Mount 20-TSSOP-EP
AS3658-BCTP

AS3658-BCTP

IC PMU POWER/AUDIO 124-CTBGA

ams-OSRAM USA INC.

0 -

-

- 124-TFBGA Tape & Reel (TR) Obsolete Portable Equipment 7mA 3V ~ 5.5V -40°C ~ 85°C - - Surface Mount 124-CTBGA (8x8)
MC33VR5500V3ES

MC33VR5500V3ES

VR5500

NXP USA Inc.

0 -

-

* - Tray Active - - - - - - - -
MC33VR5500V2ES

MC33VR5500V2ES

VR5500

NXP USA Inc.

0 -

-

* - Tray Active - - - - - - - -
MAX25169ATM/VY+T

MAX25169ATM/VY+T

6-CHANNEL 150MA BACKLIGHT DRIVER

Analog Devices Inc./Maxim Integrated

0 -
MAX25169ATM/VY+T

数据表

- 48-WFQFN Exposed Pad Tape & Reel (TR) Active TFT-LCD Panels: Gamma Buffer, VCOM Driver 2mA 2.65V ~ 5.5V, 4.5V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-TQFN (7x7)
MC35FS6506CAE

MC35FS6506CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6506CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4508CAER2

MC35FS4508CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4508CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MVR5510AVMAHEP

MVR5510AVMAHEP

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tray Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA6EP

MVR5510AVMA6EP

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tray Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA4EP

MVR5510AVMA4EP

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tray Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA0EP

MVR5510AVMA0EP

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tray Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
TWL6032A1B6YFFR

TWL6032A1B6YFFR

IC POWER MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A1B6YFFR

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Last Time Buy Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
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