电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
TWL6032A2B4YFFR

TWL6032A2B4YFFR

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A2B4YFFR

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
TWL6032A2B7YFFR

TWL6032A2B7YFFR

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A2B7YFFR

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
TWL6032A2B8YFFR

TWL6032A2B8YFFR

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A2B8YFFR

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Last Time Buy Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
ADM1192ARMZ-R7

ADM1192ARMZ-R7

IC PWR MONITOR DGTL ALERT 10MSOP

Analog Devices Inc.

0 -
ADM1192ARMZ-R7

数据表

- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Cut Tape (CT) Obsolete Monitoring, Digital Current 1.7mA 3.15V ~ 26V -40°C ~ 85°C - - Surface Mount 10-MSOP
MC33PF8100CFES

MC33PF8100CFES

IC POWER MANAGEMENT I.MX8QXP

NXP USA Inc.

0 -
MC33PF8100CFES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CHES

MC33PF8100CHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8100CHES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EAES

MC33PF8100EAES

IC POWER MANAGEMENT LS1046A

NXP USA Inc.

0 -
MC33PF8100EAES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100ERES

MC33PF8100ERES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8100ERES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
LM2984T/NOPB

LM2984T/NOPB

IC CONV MICROPROCESSOR TO220-11

Texas Instruments

0 -
LM2984T/NOPB

数据表

- TO-220-11 Formed Leads Tube Obsolete Power Supplies 100mA 6V ~ 26V -40°C ~ 125°C - - Through Hole TO-220-11
MC35FS4503NAER2

MC35FS4503NAER2

FS4500

NXP USA Inc.

0 -
MC35FS4503NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX17031ETG+T

MAX17031ETG+T

IC CTLR DUAL QUICK PWM SD 24TQFN

Analog Devices Inc./Maxim Integrated

0 -
MAX17031ETG+T

数据表

Quick-PWM™ 24-WFQFN Exposed Pad Tape & Reel (TR) Active Power Supplies 100µA 6V ~ 24V -40°C ~ 85°C - - Surface Mount 24-TQFN (4x4)
MC33FS8435G0ESR2

MC33FS8435G0ESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8435G0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8435G0KSR2

MC33FS8435G0KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8435G0KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC35FS6512NAE

MC35FS6512NAE

FS6500

NXP USA Inc.

0 -
MC35FS6512NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
AMP8DS1QF74

AMP8DS1QF74

MULTI-RAIL POWER PLATFORM 1A

AnDAPT, Inc.

0 -
AMP8DS1QF74

数据表

- 74-PowerWFQFN Tape & Reel (TR) Active Battery Charger, Digital Power Management, Power Component Integrator 1A 12V -40°C ~ 85°C (TA) - - Surface Mount 74-QFN (8x8)
MC35FS4507CAE

MC35FS4507CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4507CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS8430G2ES

MC33FS8430G2ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* - Tray Active - - - - - - - -
MC33FS8430G4ES

MC33FS8430G4ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* - Tray Active - - - - - - - -
MC33PF8200DEESR2

MC33PF8200DEESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DEESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200D2ESR2

MC33PF8200D2ESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200D2ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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