电源管理 - 专用
电源管理 - 专用
专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.
宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TWL6032A2B4YFFRIC PWR/BATT MGMT 155DSBGA |
0 | - |
|
数据表 |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Active | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
|
TWL6032A2B7YFFRIC PWR/BATT MGMT 155DSBGA |
0 | - |
|
数据表 |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Active | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
|
TWL6032A2B8YFFRIC PWR/BATT MGMT 155DSBGA |
0 | - |
|
数据表 |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Last Time Buy | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
|
ADM1192ARMZ-R7IC PWR MONITOR DGTL ALERT 10MSOP |
0 | - |
|
数据表 |
- | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | Cut Tape (CT) | Obsolete | Monitoring, Digital Current | 1.7mA | 3.15V ~ 26V | -40°C ~ 85°C | - | - | Surface Mount | 10-MSOP |
|
MC33PF8100CFESIC POWER MANAGEMENT I.MX8QXP |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100CHESIC POWER MANAGEMENT I.MX8QM |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100EAESIC POWER MANAGEMENT LS1046A |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
LM2984T/NOPBIC CONV MICROPROCESSOR TO220-11 |
0 | - |
|
数据表 |
- | TO-220-11 Formed Leads | Tube | Obsolete | Power Supplies | 100mA | 6V ~ 26V | -40°C ~ 125°C | - | - | Through Hole | TO-220-11 |
|
MC35FS4503NAER2FS4500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MAX17031ETG+TIC CTLR DUAL QUICK PWM SD 24TQFN |
0 | - |
|
数据表 |
Quick-PWM™ | 24-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Power Supplies | 100µA | 6V ~ 24V | -40°C ~ 85°C | - | - | Surface Mount | 24-TQFN (4x4) |
|
MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6512NAEFS6500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
AMP8DS1QF74MULTI-RAIL POWER PLATFORM 1A |
0 | - |
|
数据表 |
- | 74-PowerWFQFN | Tape & Reel (TR) | Active | Battery Charger, Digital Power Management, Power Component Integrator | 1A | 12V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 74-QFN (8x8) |
|
MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 |
0 | - |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 |
0 | - |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |

