电源管理 - 专用
电源管理 - 专用
专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.
宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
UCD9240RGCRIC DGTL PWM SYSTEM CTRLR 64VQFN |
0 | - |
|
数据表 |
Fusion Digital Power™ | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Special Purpose | - | 3V ~ 3.6V | -40°C ~ 110°C | - | - | Surface Mount | 64-VQFN (9x9) |
|
TWL6032A2B6YFFTIC PWR/BATT MGMT 155DSBGA |
0 | - |
|
数据表 |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Discontinued at Digi-Key | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
|
MC35FS6512CAER2FS6500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS4501CAEFS4500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS6501CAEFS6500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC34PF8100FJEPPOWER MANAGEMENT IC, I.MX8, PRE- |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
LT8253AHUFDM#TRPBF40V USB TYPE-C PD 60W 4-SW BUCK- |
0 | - |
|
数据表 |
- | 28-WFQFN Exposed Pad | Tape & Reel (TR) | Active | USB, Type-C Controller | 2.1mA | 4V ~ 40V | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 28-QFN (4x5) |
|
MC35FS6508CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC34FS6407NAER2SYSTEM BASIS CHIP CAN 5V 0.7 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-HLQFP (7x7) |
|
TPS65073RSLRIC PWR MGMT 5CH W/2 LDO 48VQFN |
0 | - |
|
数据表 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Mobile/OMAP™ | - | 2.8V ~ 6.3V | -40°C ~ 85°C | - | - | Surface Mount | 48-VQFN (6x6) |

