电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33PF8200DBESR2

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DBESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200EMESR2

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200EMESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETESR2

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200ETESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200A0ESR2

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
MC33PF8200A0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DNESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DMESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DFESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DHESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200ESESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200CXESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
UCD9240RGCR

UCD9240RGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

0 -
UCD9240RGCR

数据表

Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
TWL6032A2B6YFFT

TWL6032A2B6YFFT

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A2B6YFFT

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS6512CAER2

MC35FS6512CAER2

FS6500

NXP USA Inc.

0 -
MC35FS6512CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAE

MC35FS4501CAE

FS4500

NXP USA Inc.

0 -
MC35FS4501CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501CAE

MC35FS6501CAE

FS6500

NXP USA Inc.

0 -
MC35FS6501CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34PF8100FJEP

MC34PF8100FJEP

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0 -
MC34PF8100FJEP

数据表

- 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LT8253AHUFDM#TRPBF

LT8253AHUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

0 -
LT8253AHUFDM#TRPBF

数据表

- 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
MC35FS6508CAER2

MC35FS6508CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6508CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34FS6407NAER2

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.

0 -
MC34FS6407NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
TPS65073RSLR

TPS65073RSLR

IC PWR MGMT 5CH W/2 LDO 48VQFN

Texas Instruments

0 -
TPS65073RSLR

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
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