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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
DIP324-011B

DIP324-011B

DIP324-011B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
DIP324-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-83-306-41-003101

116-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
02-0513-11H

02-0513-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0513-11H

数据表

0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0513-10

数据表

0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ED020PLCZ-SM-N

ED020PLCZ-SM-N

CONN SOCKET PLCC 20POS

On Shore Technology Inc.

0 -
ED020PLCZ-SM-N

数据表

ED Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
AR 18 HGL-TT

AR 18 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 18 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-87-318-41-001151

110-87-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PRT-07937

PRT-07937

DIP SOCKETS SOLDER TAIL - 8-PIN

SparkFun Electronics

0 -
PRT-07937

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) - - - - Through Hole Open Frame Solder - - - - - -
110-87-312-01-680101

110-87-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
110-87-312-01-680101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-308-31-012101

614-87-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
614-87-308-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP318-001B

DIP318-001B

DIP318-001B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

0 -
DIP318-001B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-87-314-41-005101

110-87-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-87-314-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X09-157B

SIP050-1X09-157B

1X09-157B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X09-157B

数据表

SIP050-1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-83-310-41-001101

110-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-310-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-009101

116-87-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS044-Z-SM/P

A-CCS044-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS044-Z-SM/P

数据表

- Bulk Active PLCC 44 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
114-83-308-41-117101

114-83-308-41-117101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
114-83-308-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
822473-3

822473-3

CONN SOCKET PLCC 32POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
822473-3

数据表

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic -
614-87-610-41-001101

614-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-610-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-99-084-24-000000

940-99-084-24-000000

CONN SOCKET PLCC 84POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-084-24-000000

数据表

940 Tube Obsolete PLCC 84 (4 x 21) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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