IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
SIP1X17-001B

SIP1X17-001B

SIP1X17-001B-SIP SOCKET 17 CTS

Amphenol ICC (FCI)

0 -
SIP1X17-001B

数据表

SIP1x Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
04-0513-11

04-0513-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0513-11

数据表

0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-382714-1

2-382714-1

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
2-382714-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
1051631001

1051631001

SMIA65 CAMERA SOCKET CONTACT

Molex

0 -
1051631001

数据表

105163 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.037" (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.037" (0.95mm) Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
1051900001

1051900001

TOP-MOUNT CAMERA SOCKET FOR SMIA

Molex

0 -
1051900001

数据表

105190 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.033" (0.85mm) Gold 12.0µin (0.30µm) Phosphor Bronze Alloy Surface Mount Open Frame Solder 0.033" (0.85mm) Gold Flash Phosphor Bronze Alloy Thermoplastic -55°C ~ 85°C
540-88-032-17-400

540-88-032-17-400

CONN SOCKET PLCC 32POS TIN

Preci-Dip

0 -
540-88-032-17-400

数据表

540 Bulk Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
808-AG11D-ESL-LF

808-AG11D-ESL-LF

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
808-AG11D-ESL-LF

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
116-83-306-41-007101

116-83-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-316-41-003101

115-87-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
115-87-316-41-003101

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 24 HGL-TT

AR 24 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 24 HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 24 HGL/7-TT

AR 24 HGL/7-TT

SOCKET

Assmann WSW Components

0 -
AR 24 HGL/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-87-320-41-005101

110-87-320-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-320-41-605101

110-87-320-41-605101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
233-84

233-84

CONN SOCKET PLCC 84POS TIN

CNC Tech

0 -
233-84

数据表

- Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
3-382568-2

3-382568-2

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

0 -
3-382568-2

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
614-83-308-31-012101

614-83-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
614-83-308-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-308-41-134191

114-83-308-41-134191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
114-83-308-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A22-LCG-T-R

A22-LCG-T-R

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

0 -
A22-LCG-T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
SIP050-1X10-160B

SIP050-1X10-160B

1X10-160B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X10-160B

数据表

SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SU1210200000G

SU1210200000G

SU-2*6P RED ; 10.0MM CLIP PLATI

Amphenol Anytek

0 -
SU1210200000G

数据表

SU Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
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