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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
SIP050-1X13-157B

SIP050-1X13-157B

1X13-157B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X13-157B

数据表

SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-87-424-41-001101

110-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-424-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-2513-10T

06-2513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-2513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-0518-00

06-0518-00

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0518-00

数据表

518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-1518-00

06-1518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
AR28-HZL/7/01-TT

AR28-HZL/7/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZL/7/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-83-306-41-002101

116-83-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP628-011B

DIP628-011B

DIP628-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP628-011B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-310-41-012101

116-87-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-322-41-001151

110-87-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-322-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-0513-10T

06-0513-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0513-10T

数据表

0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0503-21

01-0503-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0503-21

数据表

0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
116-87-308-41-009101

116-87-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1814640-2

1814640-2

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors

0 -
1814640-2

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold 5.00µin (0.127µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
614-87-314-41-001101

614-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
614-87-314-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
02-0503-20

02-0503-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-20

数据表

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
02-0503-30

02-0503-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-30

数据表

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
09-0518-10T

09-0518-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-10T

数据表

518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-1518-10

10-1518-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A-CCS084-Z-SM/P

A-CCS084-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS084-Z-SM/P

数据表

- Bulk Active PLCC 84 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
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