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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-83-308-41-105161

110-83-308-41-105161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-83-308-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AJ 52-LC

AJ 52-LC

SOCKET

Assmann WSW Components

0 -
AJ 52-LC

数据表

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
1051990001

1051990001

CONN CAM SOCKET 34POS GOLD

Molex

0 -
1051990001

数据表

105199 Tape & Reel (TR) Obsolete Camera Socket 34 (2 x 8, 2 x 9) 0.024" (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024" (0.60mm) - - Copper Alloy Plastic -30°C ~ 85°C
06-3518-10

06-3518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3518-10

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-0518-10H

08-0518-10H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0518-10H

数据表

518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-316-41-001101

115-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
115-87-316-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-420-41-005101

110-87-420-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-420-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2-641602-4

2-641602-4

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
2-641602-4

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic -55°C ~ 125°C
917-83-104-41-005101

917-83-104-41-005101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

0 -
917-83-104-41-005101

数据表

917 Bulk Active Transistor, TO-5 4 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-210-01-742101

110-83-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-210-01-742101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
231-44

231-44

CONN SOCKET PLCC 44POS GOLD

CNC Tech

0 -
231-44

数据表

- Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
06-3513-10T

06-3513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
A-CCS20-G-R

A-CCS20-G-R

CONN SOCKET PLCC 20POS GOLD

Assmann WSW Components

0 -
A-CCS20-G-R

数据表

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
AR24-HZL/7/01-TT

AR24-HZL/7/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
AR24-HZL/7/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
SIP050-1X11-160B

SIP050-1X11-160B

1X11-160B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X11-160B

数据表

SIP050-1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR 42-HGL-TT

AR 42-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 42-HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
822473-4

822473-4

CONN SOCKET PLCC 44POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
822473-4

数据表

- Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic -
115-87-318-41-001101

115-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
115-87-318-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-312-41-005101

110-83-312-41-005101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
110-83-312-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-018101

116-87-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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