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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-87-316-41-105161

110-87-316-41-105161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-87-316-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0513-10T

08-0513-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0513-10T

数据表

0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A-CCS28-G

A-CCS28-G

CONN SOCKET PLCC 28POS GOLD

Assmann WSW Components

0 -
A-CCS28-G

数据表

- Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
116-87-316-41-006101

116-87-316-41-006101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-006101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-306-41-011101

116-83-306-41-011101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-312-41-001101

614-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
614-83-312-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-314-41-003101

115-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
115-83-314-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-308-41-035101

146-83-308-41-035101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
146-83-308-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
643652-3

643652-3

CONN SOCKET SIP 20POS TIN

TE Connectivity AMP Connectors

0 -
643652-3

数据表

Diplomate DL Tray Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
A-CCS068-Z-SM/T

A-CCS068-Z-SM/T

SOCKET

Assmann WSW Components

0 -
A-CCS068-Z-SM/T

数据表

- Bulk Active PLCC 68 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AJ 64-LC

AJ 64-LC

SOCKET

Assmann WSW Components

0 -
AJ 64-LC

数据表

- Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
114-87-306-41-134191

114-87-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
114-87-306-41-134191

数据表

114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PRT-07942

PRT-07942

DIP SOCKETS SOLDER TAIL - 28-PIN

SparkFun Electronics

0 -
PRT-07942

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - - Through Hole Open Frame Solder - - - - - -
123-87-312-41-001101

123-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
123-87-312-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-044-24-000000

540-99-044-24-000000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-044-24-000000

数据表

540 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
1571539-1

1571539-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors

0 -
1571539-1

数据表

- Bulk Obsolete PLCC 20 (4 x 5) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 125°C
110-87-328-41-001101

110-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-328-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-TT-2

HLS-0204-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-TT-2

数据表

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
09-0513-10

09-0513-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0513-10

数据表

0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-0513-10T

10-0513-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0513-10T

数据表

0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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