IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
12-0518-10T

12-0518-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-10T

数据表

518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-1518-10T

12-1518-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-83-312-41-001101

612-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
612-83-312-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-020-05-001101

510-83-020-05-001101

CONN SOCKET PGA 20POS GOLD

Preci-Dip

0 -
510-83-020-05-001101

数据表

510 Bulk Active PGA 20 (5 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-318-41-134191

114-87-318-41-134191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
114-87-318-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS 028-Z-SM/T

A-CCS 028-Z-SM/T

IC SOCKET, CHIP CARRIER, 1.27MM,

Assmann WSW Components

0 -
A-CCS 028-Z-SM/T

数据表

- Tape & Reel (TR) Active PLCC 28 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
2-640358-2

2-640358-2

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
2-640358-2

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
110-87-316-41-105101

110-87-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-87-316-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR28-HZL/01-TT

AR28-HZL/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
114-87-322-41-117101

114-87-322-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
114-87-322-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
04-0513-11H

04-0513-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0513-11H

数据表

0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-87-318-41-001101

614-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
614-87-318-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X14-160B

SIP050-1X14-160B

1X14-160B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X14-160B

数据表

SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
643642-2

643642-2

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

0 -
643642-2

数据表

Diplomate DL Tray Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
614-83-210-41-001101

614-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-83-210-41-001101

数据表

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-83-214-10-001101

410-83-214-10-001101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
410-83-214-10-001101

数据表

410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-83-214-10-002101

410-83-214-10-002101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
410-83-214-10-002101

数据表

410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP640-014B

DIP640-014B

DIP640-014B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

0 -
DIP640-014B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
814-AG11D-ESL

814-AG11D-ESL

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
814-AG11D-ESL

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
1814640-6

1814640-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
1814640-6

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Thermoplastic, Polyester -55°C ~ 125°C
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