IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
D01-9950742

D01-9950742

CONN SOCKET SIP 7POS GOLD

Harwin Inc.

0 -
D01-9950742

数据表

D01-995 Tube Obsolete SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-003101

116-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-420-41-003101

115-87-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-87-420-41-003101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X16-157B

SIP050-1X16-157B

1X16-157B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X16-157B

数据表

SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
114-83-314-41-117101

114-83-314-41-117101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
114-83-314-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-314-41-134161

114-83-314-41-134161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
114-83-314-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-003101

116-87-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-028-06-001101

510-87-028-06-001101

CONN SOCKET PGA 28POS GOLD

Preci-Dip

0 -
510-87-028-06-001101

数据表

510 Bulk Active PGA 28 (6 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-1-24-006

210-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

0 -
210-1-24-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
822472-7

822472-7

CONN SOCKET PLCC 84POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
822472-7

数据表

- Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
115-87-422-41-001101

115-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
115-87-422-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-210-41-012101

116-87-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-210-41-012101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-008101

116-83-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-83-308-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-308-41-036101

146-83-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
146-83-308-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-3518-11

06-3518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3518-11

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-610-41-003101

116-83-610-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
643648-1

643648-1

CONN SOCKET SIP 16POS TIN

TE Connectivity AMP Connectors

0 -
643648-1

数据表

Diplomate DL Tray Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
540-88-044-17-400

540-88-044-17-400

CONN SOCKET PLCC 44POS TIN

Preci-Dip

0 -
540-88-044-17-400

数据表

540 Bulk Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
116-87-210-41-009101

116-87-210-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-210-41-009101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-310-41-009101

116-87-310-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户