IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
814-AG11D

814-AG11D

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
814-AG11D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
20-3540-10

20-3540-10

COLLET PIN CARRIER 20-PIN .300

Aries Electronics

0 -
20-3540-10

数据表

- - Obsolete - - - - - - - - - - - - - - -
116-87-324-41-018101

116-87-324-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-324-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-318-41-007101

116-87-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-006101

116-83-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-316-41-009101

116-87-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
07-0513-11

07-0513-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0513-11

数据表

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
7-1437539-0

7-1437539-0

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
7-1437539-0

数据表

800 Tube Obsolete DIP, 0.5 to 0.6" Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
116-87-424-41-006101

116-87-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-424-41-006101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 48-HZL/01-TT

AR 48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0 -
AR 48-HZL/01-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
1571540-1

1571540-1

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors

0 -
1571540-1

数据表

- Bulk Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
15-0513-10

15-0513-10

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0513-10

数据表

0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-4518-10T

20-4518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-10T

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-0518-10H

18-0518-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0518-10H

数据表

518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-1518-10H

18-1518-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-87-624-41-001101

614-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
614-87-624-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-640-41-605101

110-87-640-41-605101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-87-640-41-605101

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-640-41-005101

110-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-87-640-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-044-12-071101

510-87-044-12-071101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

0 -
510-87-044-12-071101

数据表

510 Bulk Active PGA 44 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-324-41-001101

115-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-83-324-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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