IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
AR 52-HZL/07-TT

AR 52-HZL/07-TT

SOCKET

Assmann WSW Components

0 -
AR 52-HZL/07-TT

数据表

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
214-44-314-01-670799

214-44-314-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
214-44-314-01-670799

数据表

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
214-99-314-01-670799

214-99-314-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
214-99-314-01-670799

数据表

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
20-3518-10M

20-3518-10M

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3518-10M

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-83-432-41-001101

612-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
612-83-432-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-107-12-051101

510-87-107-12-051101

CONN SOCKET PGA 107POS GOLD

Preci-Dip

0 -
510-87-107-12-051101

数据表

510 Bulk Active PGA 107 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-648-41-005101

117-83-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
117-83-648-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2134146-3

2134146-3

CONN SOCKET PGA 989POS GOLD

TE Connectivity AMP Connectors

0 -
2134146-3

数据表

- Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
A-ICS-254-28-TT50

A-ICS-254-28-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-28-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-83-328-41-007101

116-83-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-328-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
04-0501-21

04-0501-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0501-21

数据表

501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
04-0501-31

04-0501-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0501-31

数据表

501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-3513-00

20-3513-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3513-00

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0503-30

09-0503-30

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0503-30

数据表

0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
18-0518-11H

18-0518-11H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0518-11H

数据表

518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-1518-11H

18-1518-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0508-20

11-0508-20

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0508-20

数据表

508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
11-0508-30

11-0508-30

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0508-30

数据表

508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
16-3518-101H

16-3518-101H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3518-101H

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-93-620-41-005000

117-93-620-41-005000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-93-620-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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