IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
07-0511-10

07-0511-10

CONN SOCKET SIP 7POS TIN

Aries Electronics

0 -
07-0511-10

数据表

511 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-83-065-10-052101

510-83-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

0 -
510-83-065-10-052101

数据表

510 Bulk Active PGA 65 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-ZSGG

ICA-308-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-ZSGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZSGG

ICO-308-ZSGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-ZSGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICF-328-T-I

ICF-328-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-T-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-328-TM-O

ICF-328-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-TM-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-628-TM-O

ICF-628-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-TM-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
110-83-328-41-105191

110-83-328-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-328-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
26-0518-11

26-0518-11

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0 -
26-0518-11

数据表

518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
26-1518-11

26-1518-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-0518-10H

32-0518-10H

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0518-10H

数据表

518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0110-T-12

HLS-0110-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0110-T-12

数据表

HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0114-T-2-L

HLS-0114-T-2-L

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-T-2-L

数据表

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
540-44-028-17-400000

540-44-028-17-400000

CONN SOCKET PLCC 28POS TIN

Mill-Max Manufacturing Corp.

0 -
540-44-028-17-400000

数据表

540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
ICA-316-ZWTT-2

ICA-316-ZWTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZWTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-422-MTT

ICO-422-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-MTT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0205-T-32

HLS-0205-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0205-T-32

数据表

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-125-13-041101

510-87-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip

0 -
510-87-125-13-041101

数据表

510 Bulk Active PGA 125 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-632-41-009101

116-87-632-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-87-632-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-432-41-007101

116-83-432-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-432-41-007101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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