IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-87-952-31-012101

614-87-952-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
614-87-952-31-012101

数据表

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-624-41-011101

116-83-624-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-624-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-656-41-005101

117-83-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

0 -
117-83-656-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-320-SST

ICA-320-SST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-SST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-422-CTT

ICO-422-CTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-CTT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-428-41-002101

116-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-428-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-628-LTT

ICO-628-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-LTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
APH-0902-G-T

APH-0902-G-T

APH-0902-G-T

Samtec Inc.

0 -
APH-0902-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1402-G-T

APH-1402-G-T

APH-1402-G-T

Samtec Inc.

0 -
APH-1402-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1502-G-T

APH-1502-G-T

APH-1502-G-T

Samtec Inc.

0 -
APH-1502-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1902-G-T

APH-1902-G-T

APH-1902-G-T

Samtec Inc.

0 -
APH-1902-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1602-G-T

APH-1602-G-T

APH-1602-G-T

Samtec Inc.

0 -
APH-1602-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0802-G-T

APH-0802-G-T

APH-0802-G-T

Samtec Inc.

0 -
APH-0802-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0402-G-T

APH-0402-G-T

APH-0402-G-T

Samtec Inc.

0 -
APH-0402-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1702-G-T

APH-1702-G-T

APH-1702-G-T

Samtec Inc.

0 -
APH-1702-G-T

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0107-G-32

HLS-0107-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0107-G-32

数据表

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICO-308-ZAGG

ICO-308-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-ZAGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APA-628-T-J

APA-628-T-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-628-T-J

数据表

APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
110-83-642-41-105161

110-83-642-41-105161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
110-83-642-41-105161

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-636-41-035101

146-87-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
146-87-636-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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