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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
146-87-636-41-036101

146-87-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
146-87-636-41-036101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-652-41-003101

116-87-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-648-31-012101

614-87-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
614-87-648-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-624-SST

ICA-624-SST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-SST

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-316-ZSGT-L

ICA-316-ZSGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZSGT-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
22-3513-11

22-3513-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-318-ZSST

ICA-318-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
110-83-640-41-105101

110-83-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-83-640-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8114LB603 REV J

8114LB603 REV J

CONN TRANSIST TO-3 4POS TIN

Boyd Laconia, LLC

0 -
8114LB603 REV J

数据表

8180 Bulk Active Transistor, TO-3 4 (Oval) - Tin - Brass Through Hole Closed Frame Solder - Tin - Brass Phenolic -
116-83-640-41-018101

116-83-640-41-018101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-83-640-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-320-TL-I

ICF-320-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-320-TL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-83-642-41-006101

116-83-642-41-006101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
116-83-642-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
824-AG30D-ES

824-AG30D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
824-AG30D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
HLS-0306-T-2

HLS-0306-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0306-T-2

数据表

HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-128-13-041101

510-87-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
510-87-128-13-041101

数据表

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-042101

510-87-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
510-87-128-13-042101

数据表

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-043101

510-87-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
510-87-128-13-043101

数据表

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-071101

510-87-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
510-87-128-13-071101

数据表

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
09-0511-10

09-0511-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

0 -
09-0511-10

数据表

511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-322-41-004101

116-83-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-322-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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