IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICF-632-TM-O

ICF-632-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-632-TM-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
714-43-112-31-018000

714-43-112-31-018000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-112-31-018000

数据表

714 Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1104-T-H

APH-1104-T-H

APH-1104-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0204-T-H

APH-0204-T-H

APH-0204-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0704-T-H

APH-0704-T-H

APH-0704-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0304-T-H

APH-0304-T-H

APH-0304-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1704-T-H

APH-1704-T-H

APH-1704-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
510-87-144-13-001101

510-87-144-13-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
510-87-144-13-001101

数据表

510 Bulk Active PGA 144 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-144-13-041101

510-87-144-13-041101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
510-87-144-13-041101

数据表

510 Bulk Active PGA 144 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-G-38

HLS-0204-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-G-38

数据表

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-314-WGT-2

ICA-314-WGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-WGT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-ZSST

ICA-324-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-ZSST

ICO-324-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-ZSST

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-624-ZSST

ICO-624-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-ZSST

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-328-41-011101

116-83-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-328-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-1518-11

30-1518-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
44-1518-10

44-1518-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
44-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
PLCC-084-T-N-TR

PLCC-084-T-N-TR

CONN SOCKET PLCC 84POS TIN

Samtec Inc.

0 -
PLCC-084-T-N-TR

数据表

PLCC Tape & Reel (TR) Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-2007-G-12

HLS-2007-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-2007-G-12

数据表

HLS Bulk Active SIP 140 (20 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
23-0513-11

23-0513-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0513-11

数据表

0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户