IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1904-T-R

APH-1904-T-R

APH-1904-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APO-308-T-J

APO-308-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0604-T-R

APH-0604-T-R

APH-0604-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1204-T-R

APH-1204-T-R

APH-1204-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0704-T-R

APH-0704-T-R

APH-0704-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICA-320-WTT-3

ICA-320-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-WTT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-320-SST-L

ICA-320-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-SST-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-G-18

HLS-0204-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-G-18

数据表

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
25-0518-00

25-0518-00

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0518-00

数据表

518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-0518-11

36-0518-11

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0518-11

数据表

518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0508-20

13-0508-20

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0508-20

数据表

508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
13-0508-30

13-0508-30

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0508-30

数据表

508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
06-6820-90C

06-6820-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICF-640-STL-O-TR

ICF-640-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-STL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-640-TL-O-TR

ICF-640-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-TL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
612-87-952-41-001101

612-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
612-87-952-41-001101

数据表

612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-632-T-J

APA-632-T-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-T-J

数据表

APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
36-6511-10

36-6511-10

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

0 -
36-6511-10

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-6518-10T

40-6518-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-10T

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-142-15-081101

510-87-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip

0 -
510-87-142-15-081101

数据表

510 Bulk Active PGA 142 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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