IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
22-4518-10M

22-4518-10M

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4518-10M

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-83-648-41-001101

612-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
612-83-648-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-TT-12

HLS-0120-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-TT-12

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
116-87-640-41-002101

116-87-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-87-640-41-002101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZMGG

ICO-308-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-ZMGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-652-41-012101

116-87-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-012101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-624-SST-L

ICA-624-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-SST-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-SST-L

ICA-324-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-SST-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-SST-L

ICO-324-SST-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-SST-L

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
14-0517-90C

14-0517-90C

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0517-90C

数据表

0517 Bulk Active SIP 14 (1 x 14) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-145-13-041101

510-87-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-87-145-13-041101

数据表

510 Bulk Active PGA 145 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
12-3513-11H

12-3513-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-0518-11

30-0518-11

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0518-11

数据表

518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
APO-318-T-A

APO-318-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-T-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICA-314-SGG-L

ICA-314-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-SGG-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-632-41-009101

116-83-632-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-632-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
22-16-4

22-16-4

CONN TRANSIST TO-5 4POS GOLD

Grayhill Inc.

0 -

-

22 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled -
21-0518-11H

21-0518-11H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0518-11H

数据表

518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-83-664-41-005101

117-83-664-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
117-83-664-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-9513-11

10-9513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-9513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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