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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
10-822-90C

10-822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-316-T-C

APO-316-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-316-T-C

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-83-432-41-011101

116-83-432-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-432-41-011101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-088-12-051101

510-83-088-12-051101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

0 -
510-83-088-12-051101

数据表

510 Bulk Active PGA 88 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 28-HZL/07-TT

AR 28-HZL/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

3 -
AR 28-HZL/07-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
08-0503-21

08-0503-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0503-21

数据表

0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
08-0503-31

08-0503-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0503-31

数据表

0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
14-3518-10M

14-3518-10M

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3518-10M

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0207-T-11

HLS-0207-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0207-T-11

数据表

HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APO-422-T-A1

APO-422-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-T-A1

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
299-87-620-10-002101

299-87-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
299-87-620-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0206-T-18

HLS-0206-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0206-T-18

数据表

HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
212-1-40-006

212-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech

0 -
212-1-40-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
116-83-632-41-011101

116-83-632-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-632-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-316-T-A

APO-316-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-316-T-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0902-G-H

APH-0902-G-H

APH-0902-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1002-G-H

APH-1002-G-H

APH-1002-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1902-G-H

APH-1902-G-H

APH-1902-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1602-G-H

APH-1602-G-H

APH-1602-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0202-G-H

APH-0202-G-H

APH-0202-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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