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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
15-0511-10

15-0511-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

0 -
15-0511-10

数据表

511 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-820-90T

18-820-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-820-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-820-90TWR

18-820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-820-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
HLS-0213-TT-10

HLS-0213-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0213-TT-10

数据表

HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
ICO-316-LGG

ICO-316-LGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-LGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
714-43-115-31-018000

714-43-115-31-018000

CONN SOCKET SIP 15POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-115-31-018000

数据表

714 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-83-640-41-008101

116-83-640-41-008101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-83-640-41-008101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-652-41-008101

116-87-652-41-008101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-008101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-3211-N

XR2A-3211-N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-3211-N

数据表

XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
HLS-0114-T-10

HLS-0114-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-T-10

数据表

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
122-83-640-41-001101

122-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
122-83-640-41-001101

数据表

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-6501-20

16-6501-20

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
16-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-314-ZAGT

ICO-314-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-ZAGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-101-11-001101

510-83-101-11-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

0 -
510-83-101-11-001101

数据表

510 Bulk Active PGA 101 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-0511-10

16-0511-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

0 -
16-0511-10

数据表

511 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-87-964-31-012101

614-87-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
614-87-964-31-012101

数据表

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6518-10T

48-6518-10T

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6518-10T

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-328-TL-O

ICF-328-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-TL-O

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-328-TL-I

ICF-328-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-TL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-628-TL-I

ICF-628-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-TL-I

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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