IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1908-T-T

APH-1908-T-T

APH-1908-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0208-T-T

APH-0208-T-T

APH-0208-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0708-T-T

APH-0708-T-T

APH-0708-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1808-T-T

APH-1808-T-T

APH-1808-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1708-T-T

APH-1708-T-T

APH-1708-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0408-T-T

APH-0408-T-T

APH-0408-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0908-T-T

APH-0908-T-T

APH-0908-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0808-T-T

APH-0808-T-T

APH-0808-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1308-T-T

APH-1308-T-T

APH-1308-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
XR2A-2025

XR2A-2025

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-2025

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
18-6513-10H

18-6513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-9513-11

20-9513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-9513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-2822-90

08-2822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
08-2823-90

08-2823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
08-820-90

08-820-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-820-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
08-822-90

08-822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
17-0517-90C

17-0517-90C

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0517-90C

数据表

0517 Bulk Active SIP 17 (1 x 17) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-314-NGT

ICO-314-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-NGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-87-168-17-001101

510-87-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

0 -
510-87-168-17-001101

数据表

510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-168-17-101101

510-87-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

0 -
510-87-168-17-101101

数据表

510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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