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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
30-0518-00

30-0518-00

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0518-00

数据表

518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
30-1518-00

30-1518-00

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-81250-610C

08-81250-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-8305-610C

08-8305-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-8305-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-87-650-41-009101

116-87-650-41-009101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-87-650-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-169-17-101101

510-87-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
510-87-169-17-101101

数据表

510 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-636-41-001101

116-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
116-83-636-41-001101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ZWGT-3

ICA-314-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZWGT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0405-S-2

HLS-0405-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0405-S-2

数据表

HLS Bulk Active SIP 20 (4 x 5) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
28-6518-10M

28-6518-10M

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-10M

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-71000-10

08-71000-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-71000-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-71250-10

08-71250-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-71250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7350-10

08-7350-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7350-11

08-7350-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-7350-11

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-7360-10

08-7360-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7360-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7390-10

08-7390-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7390-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7400-10

08-7400-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7400-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7425-10

08-7425-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7425-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7430-10

08-7430-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7430-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-7445-10

08-7445-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-7445-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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