IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APA-308-G-P

APA-308-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-G-P

数据表

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-308-G-N

APA-308-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-G-N

数据表

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-83-322-41-013101

116-83-322-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-322-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-422-41-013101

116-83-422-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-422-41-013101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-6513-10H

14-6513-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
299-83-324-11-001101

299-83-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
299-83-324-11-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-422-SGT-L

ICA-422-SGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-SGT-L

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-422-ZSGT

ICO-422-ZSGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-ZSGT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-632-CTT

ICO-632-CTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-CTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0116-T-15

HLS-0116-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0116-T-15

数据表

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-83-100-10-000101

510-83-100-10-000101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-83-100-10-000101

数据表

510 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-308-STL-O

ICF-308-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-STL-O

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICO-320-ZMGT

ICO-320-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-ZMGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
299-87-622-10-002101

299-87-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
299-87-622-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-6513-11H

18-6513-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-2810-90C

08-2810-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2810-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-0511-10

34-0511-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-0511-10

数据表

511 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-318-MGT

ICO-318-MGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-MGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0209-T-30

HLS-0209-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0209-T-30

数据表

HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
10-6503-20

10-6503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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