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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-87-652-41-009101

116-87-652-41-009101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-322-TL-I

ICF-322-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-322-TL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-322-TL-O

ICF-322-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-322-TL-O

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APO-318-T-A1

APO-318-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-T-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICA-316-ZSGG-L

ICA-316-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZSGG-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-ATT

ICA-324-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ATT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-624-ATT

ICA-624-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-ATT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-324-ATT

ICO-324-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-ATT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-624-ATT

ICO-624-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-ATT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
121-83-648-41-001101

121-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
121-83-648-41-001101

数据表

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-324-T-A1

APA-324-T-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-T-A1

数据表

APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
16-3503-20

16-3503-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APA-640-T-J

APA-640-T-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-640-T-J

数据表

APA Tube Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
117-87-448-41-105101

117-87-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
117-87-448-41-105101

数据表

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-422-LGT

ICO-422-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-LGT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-322-LGT

ICO-322-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-LGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
04-7425-10

04-7425-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

0 -
04-7425-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7545-10

04-7545-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

0 -
04-7545-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
27-0518-11H

27-0518-11H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0518-11H

数据表

518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-3513-10H

22-3513-10H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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