IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
117-83-652-41-105101

117-83-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
117-83-652-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-097-11-041101

510-83-097-11-041101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

0 -
510-83-097-11-041101

数据表

510 Bulk Active PGA 97 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-642-41-001101

122-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
122-83-642-41-001101

数据表

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-642-41-001101

123-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
123-83-642-41-001101

数据表

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-4518-11

24-4518-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4518-11

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-180-15-001101

510-87-180-15-001101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

0 -
510-87-180-15-001101

数据表

510 Bulk Active PGA 180 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-640-LTT

ICO-640-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-LTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
APO-324-T-A1

APO-324-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-T-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-314-T-R

APO-314-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-314-T-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1508-T-H

APH-1508-T-H

APH-1508-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1008-T-H

APH-1008-T-H

APH-1008-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0208-T-H

APH-0208-T-H

APH-0208-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1608-T-H

APH-1608-T-H

APH-1608-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0808-T-H

APH-0808-T-H

APH-0808-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1308-T-H

APH-1308-T-H

APH-1308-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1708-T-H

APH-1708-T-H

APH-1708-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0308-T-H

APH-0308-T-H

APH-0308-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0408-T-H

APH-0408-T-H

APH-0408-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICF-324-F-O

ICF-324-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-324-F-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICA-324-WTT

ICA-324-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-WTT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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