IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
24-1518-11H

24-1518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
4-1814655-1

4-1814655-1

CONN SOCKET SIP 64POS GOLD

TE Connectivity AMP Connectors

0 -
4-1814655-1

数据表

- Bulk Obsolete SIP 64 (1 x 64) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
HLS-0120-T-22

HLS-0120-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-T-22

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-180-18-111101

510-87-180-18-111101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

0 -
510-87-180-18-111101

数据表

510 Bulk Active PGA 180 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-C212-11

24-C212-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-C212-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-6518-101

32-6518-101

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6518-101

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-650-41-011101

116-87-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-87-650-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-964-31-012101

614-83-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
614-83-964-31-012101

数据表

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0304-G-18

HLS-0304-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0304-G-18

数据表

HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0117-T-10

HLS-0117-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0117-T-10

数据表

HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-314-WGG-3

ICA-314-WGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-WGG-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-652-41-007101

116-83-652-41-007101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-83-652-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-628-ATT

ICA-628-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ATT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-628-ZSGT-L

ICA-628-ZSGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZSGT-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
16-3518-10E

16-3518-10E

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3518-10E

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-640-41-011101

116-83-640-41-011101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-83-640-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-320-CGT

ICO-320-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-CGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-632-NTT

ICO-632-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-NTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0112-G-11

HLS-0112-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-11

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-328-F-I

ICF-328-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-F-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户