IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0604-G-T

APH-0604-G-T

APH-0604-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1806-T-R

APH-1806-T-R

APH-1806-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1406-T-R

APH-1406-T-R

APH-1406-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0804-G-T

APH-0804-G-T

APH-0804-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0806-T-R

APH-0806-T-R

APH-0806-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1804-G-T

APH-1804-G-T

APH-1804-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1704-G-T

APH-1704-G-T

APH-1704-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0404-G-T

APH-0404-G-T

APH-0404-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
31-0518-11H

31-0518-11H

CONN SOCKET SIP 31POS GOLD

Aries Electronics

0 -
31-0518-11H

数据表

518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-181-17-082101

510-87-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-87-181-17-082101

数据表

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
31-0511-10

31-0511-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

0 -
31-0511-10

数据表

511 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-47-304-41-006000

116-47-304-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-304-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-320-ZSGG

ICO-320-ZSGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-ZSGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
347843-5

347843-5

CONN IC DIP SOCKET 10POS TINLEAD

TE Connectivity AMP Connectors

0 -

-

- Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole, Right Angle, Horizontal - Solder 0.100" (2.54mm) Tin-Lead - Beryllium Copper - -
MVAS-114-ZSGT-13

MVAS-114-ZSGT-13

CONN SOCKET PGA 114POS GOLD

Samtec Inc.

0 -
MVAS-114-ZSGT-13

数据表

MVAS Tube Obsolete PGA 114 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - -
19-0508-20

19-0508-20

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0508-20

数据表

508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
19-0508-30

19-0508-30

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0508-30

数据表

508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
346-93-124-41-013000

346-93-124-41-013000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-124-41-013000

数据表

346 Tube Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-124-41-013000

346-43-124-41-013000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-124-41-013000

数据表

346 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HIC-764-SST

HIC-764-SST

CONN IC DIP SOCKET 64POS GOLD

Samtec Inc.

0 -
HIC-764-SST

数据表

HIC Tube Obsolete DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Gold 200.0µin (5.08µm) Brass Polyester, Glass Filled -
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