IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-43-304-41-001000

116-43-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-304-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-102

40-6518-102

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-102

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-648-41-004101

116-87-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1812-T-R

APH-1812-T-R

APH-1812-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1012-T-R

APH-1012-T-R

APH-1012-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APO-624-T-J

APO-624-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0212-T-R

APH-0212-T-R

APH-0212-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1712-T-R

APH-1712-T-R

APH-1712-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1212-T-R

APH-1212-T-R

APH-1212-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0312-T-R

APH-0312-T-R

APH-0312-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0412-T-R

APH-0412-T-R

APH-0412-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
13-0503-21

13-0503-21

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0503-21

数据表

0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
13-0503-31

13-0503-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0503-31

数据表

0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
20-0503-30

20-0503-30

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0503-30

数据表

0503 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
20-3518-01

20-3518-01

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3518-01

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-4518-01

20-4518-01

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-01

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-C182-11

24-C182-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-C182-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-C300-11

24-C300-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-C300-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICO-624-SGG-L

ICO-624-SGG-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-SGG-L

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-624-SGG-L

ICA-624-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-SGG-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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