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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
3-1437508-9

3-1437508-9

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -

-

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
ICA-640-ZWTT

ICA-640-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZWTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
08-2503-31

08-2503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2503-31

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-3513-10H

32-3513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-6511-11

18-6511-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6511-11

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-83-142-15-081101

510-83-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip

0 -
510-83-142-15-081101

数据表

510 Bulk Active PGA 142 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-125-31-018000

714-43-125-31-018000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-125-31-018000

数据表

714 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
PGA241H009B5-1849R

PGA241H009B5-1849R

PGA SOCKET 241 CTS

Amphenol ICC (FCI)

0 -
PGA241H009B5-1849R

数据表

- - Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
APH-1510-T-T

APH-1510-T-T

APH-1510-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1010-T-T

APH-1010-T-T

APH-1010-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0710-T-T

APH-0710-T-T

APH-0710-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1810-T-T

APH-1810-T-T

APH-1810-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-T-T

APH-0310-T-T

APH-0310-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
HLS-0308-T-38

HLS-0308-T-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0308-T-38

数据表

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
40-6518-112

40-6518-112

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-112

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-316-WGG-3

ICA-316-WGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-WGG-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0308-T-12

HLS-0308-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0308-T-12

数据表

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0120-G-22

HLS-0120-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-22

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICO-624-MGG

ICO-624-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-MGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
12-6820-90C

12-6820-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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