IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-422-ZAGG

ICA-422-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-ZAGG

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-87-262-20-091101

510-87-262-20-091101

CONN SOCKET PGA 262POS GOLD

Preci-Dip

0 -
510-87-262-20-091101

数据表

510 Bulk Active PGA 262 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-422-CGT

ICO-422-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-CGT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-1416-T-R

APH-1416-T-R

APH-1416-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0916-T-R

APH-0916-T-R

APH-0916-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0516-T-R

APH-0516-T-R

APH-0516-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1016-T-R

APH-1016-T-R

APH-1016-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0616-T-R

APH-0616-T-R

APH-0616-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1116-T-R

APH-1116-T-R

APH-1116-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0316-T-R

APH-0316-T-R

APH-0316-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1716-T-R

APH-1716-T-R

APH-1716-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0416-T-R

APH-0416-T-R

APH-0416-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1616-T-R

APH-1616-T-R

APH-1616-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0716-T-R

APH-0716-T-R

APH-0716-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0816-T-R

APH-0816-T-R

APH-0816-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
16-820-90T

16-820-90T

RT ANGLE 16 PIN SKT .1 INCH CTR

Aries Electronics

0 -

-

Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 105°C
28-3518-112

28-3518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3518-112

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-6518-112

28-6518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-112

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-87-068-10-061112

614-87-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
614-87-068-10-061112

数据表

614 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-640-41-004101

116-83-640-41-004101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-83-640-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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