IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0304-G-H

APH-0304-G-H

APH-0304-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1304-G-H

APH-1304-G-H

APH-1304-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1704-G-H

APH-1704-G-H

APH-1704-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
299-93-620-10-002000

299-93-620-10-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
299-93-620-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-145-15-001101

510-83-145-15-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-83-145-15-001101

数据表

510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-145-15-002101

510-83-145-15-002101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-83-145-15-002101

数据表

510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-145-15-081101

510-83-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-83-145-15-081101

数据表

510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-324-T-T

APO-324-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-T-T

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
32-0518-11H

32-0518-11H

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0518-11H

数据表

518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-6518-111

32-6518-111

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6518-111

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-83-161-14-051101

510-83-161-14-051101

CONN SOCKET PGA 161POS GOLD

Preci-Dip

0 -
510-83-161-14-051101

数据表

510 Bulk Active PGA 161 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-324-ZLGG

ICO-324-ZLGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-ZLGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APA-628-T-A

APA-628-T-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-628-T-A

数据表

APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-628-T-A

APO-628-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-T-A

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
28-6518-11H

28-6518-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-11H

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0210-G-11

HLS-0210-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0210-G-11

数据表

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-624-WGT-3

ICA-624-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-WGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-632-41-013101

116-83-632-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-632-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-640-CTT

ICO-640-CTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-CTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
123-43-316-41-801000

123-43-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

19 -
123-43-316-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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