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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
28-6518-10E

28-6518-10E

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-10E

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-6503-21

12-6503-21

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-6503-31

12-6503-31

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APA-632-T-N

APA-632-T-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-T-N

数据表

APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
299-83-628-10-002101

299-83-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
299-83-628-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-148-15-062101

510-83-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

0 -
510-83-148-15-062101

数据表

510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-648-T-A1

APA-648-T-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-T-A1

数据表

APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
60-9513-10

60-9513-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
60-9513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
36-6513-11

36-6513-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-316-WGG

ICA-316-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-WGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
4-1437538-8

4-1437538-8

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors

0 -
4-1437538-8

数据表

800 Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
4-1437531-9

4-1437531-9

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

0 -

-

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin - Copper Alloy - -55°C ~ 105°C
ICO-632-ZLGT

ICO-632-ZLGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZLGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-1910-T-H

APH-1910-T-H

APH-1910-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1510-T-H

APH-1510-T-H

APH-1510-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1810-T-H

APH-1810-T-H

APH-1810-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0410-T-H

APH-0410-T-H

APH-0410-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0810-T-H

APH-0810-T-H

APH-0810-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
510-83-149-15-003101

510-83-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
510-83-149-15-003101

数据表

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-149-15-061101

510-83-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
510-83-149-15-061101

数据表

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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