IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1614-T-R

APH-1614-T-R

APH-1614-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0908-G-T

APH-0908-G-T

APH-0908-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1214-T-R

APH-1214-T-R

APH-1214-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0814-T-R

APH-0814-T-R

APH-0814-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-T

APH-0708-G-T

APH-0708-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
16-810-90

16-810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
13-7450-10

13-7450-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-7450-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
13-7970-10

13-7970-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-7970-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
38-3513-11

38-3513-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-0503-21

15-0503-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0503-21

数据表

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
15-0503-31

15-0503-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0503-31

数据表

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0508-20

22-0508-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0508-20

数据表

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-0508-30

22-0508-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0508-30

数据表

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-1508-30

22-1508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-17-001101

数据表

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-17-082101

510-83-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-17-082101

数据表

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-14-031101

510-83-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-14-031101

数据表

510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-15-001101

510-83-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-15-001101

数据表

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0501-20

18-0501-20

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-0501-20

数据表

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-0501-30

18-0501-30

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-0501-30

数据表

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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