IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-318-AGG

ICA-318-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-AGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-AGG

ICO-318-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-AGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
14-7350-10

14-7350-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-7380-10

14-7380-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7380-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-7470-10

14-7470-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7470-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-7500-10

14-7500-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-7750-10

14-7750-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7750-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-823-90C

24-823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0501-21

09-0501-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0501-21

数据表

501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
09-0501-31

09-0501-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0501-31

数据表

501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-2503-21

10-2503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-21

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-2503-31

10-2503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-31

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-9513-10H

32-9513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICF-624-STL-I

ICF-624-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-STL-I

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-624-STL-O

ICF-624-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-STL-O

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APH-1820-T-T

APH-1820-T-T

APH-1820-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1420-T-T

APH-1420-T-T

APH-1420-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0520-T-T

APH-0520-T-T

APH-0520-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0620-T-T

APH-0620-T-T

APH-0620-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1620-T-T

APH-1620-T-T

APH-1620-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
深圳市宝利科技有限公司

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