IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-87-299-20-001101

510-87-299-20-001101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
510-87-299-20-001101

数据表

510 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-299-20-091101

510-87-299-20-091101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
510-87-299-20-091101

数据表

510 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-80-084-10-031101

550-80-084-10-031101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-084-10-031101

数据表

550 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-80-084-13-081101

550-80-084-13-081101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-084-13-081101

数据表

550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8060-1G34

8060-1G34

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0 -

-

8060 - Obsolete Transistor, TO-5 3 (Round) - Gold - - - - Solder - - - - - -
20-4508-20

20-4508-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4508-20

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-628-SGG-L

ICA-628-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-SGG-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APO-624-T-C

APO-624-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-T-C

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
16-3508-301

16-3508-301

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-301

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-822-90

14-822-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
510-87-300-21-001101

510-87-300-21-001101

CONN SOCKET PGA 300POS GOLD

Preci-Dip

0 -
510-87-300-21-001101

数据表

510 Bulk Active PGA 300 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-318-STL-I

ICF-318-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-STL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-640-TL-I-TR

ICF-640-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICA-422-AGT

ICA-422-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-AGT

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-3513-10H

28-3513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0505-T-10

HLS-0505-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0505-T-10

数据表

HLS Bulk Active SIP 25 (5 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APH-0506-G-H

APH-0506-G-H

APH-0506-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1906-G-H

APH-1906-G-H

APH-1906-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0206-G-H

APH-0206-G-H

APH-0206-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0306-G-H

APH-0306-G-H

APH-0306-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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