IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0606-G-R

APH-0606-G-R

APH-0606-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1106-G-R

APH-1106-G-R

APH-1106-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1606-G-R

APH-1606-G-R

APH-1606-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1306-G-R

APH-1306-G-R

APH-1306-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0806-G-R

APH-0806-G-R

APH-0806-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1206-G-R

APH-1206-G-R

APH-1206-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0706-G-R

APH-0706-G-R

APH-0706-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
HLS-0307-G-12

HLS-0307-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0307-G-12

数据表

HLS Tube Active SIP 21 (3 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors

0 -

-

- Tray Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
13-0501-20

13-0501-20

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-0501-20

数据表

501 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
13-0501-30

13-0501-30

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-0501-30

数据表

501 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-3513-10H

40-3513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-632-ZWGT-3

ICA-632-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZWGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-G-38

HLS-0120-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-38

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
210-47-306-41-001000

210-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-306-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-448-41-005000

117-43-448-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

6 -
117-43-448-41-005000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-0501-21

14-0501-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0501-21

数据表

501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-4518-01

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4518-01

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-6820-90C

20-6820-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-6822-90C

20-6822-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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