IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1612-T-T

APH-1612-T-T

APH-1612-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1212-T-T

APH-1212-T-T

APH-1212-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1308-G-H

APH-1308-G-H

APH-1308-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0408-G-H

APH-0408-G-H

APH-0408-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1608-G-H

APH-1608-G-H

APH-1608-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1208-G-H

APH-1208-G-H

APH-1208-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1712-T-T

APH-1712-T-T

APH-1712-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-H

APH-0708-G-H

APH-0708-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0412-T-T

APH-0412-T-T

APH-0412-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0712-T-T

APH-0712-T-T

APH-0712-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
824-AG12D-LF

824-AG12D-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
824-AG12D-LF

数据表

- Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass - -
510-87-324-18-000101

510-87-324-18-000101

CONN SOCKET PGA 324POS GOLD

Preci-Dip

0 -
510-87-324-18-000101

数据表

510 Bulk Active PGA 324 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
19-0501-20

19-0501-20

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
19-0501-20

数据表

501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-0501-30

19-0501-30

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
19-0501-30

数据表

501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-309-21-001101

510-87-309-21-001101

CONN SOCKET PGA 309POS GOLD

Preci-Dip

0 -
510-87-309-21-001101

数据表

510 Bulk Active PGA 309 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-KGT

ICA-632-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-KGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
40-6518-111

40-6518-111

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-111

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-322-WGG-2

ICA-322-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-WGG-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-318-ZHGT

ICA-318-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZHGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-632-ZAGT

ICO-632-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZAGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户