IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
20-6823-90C

20-6823-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-422-ZAGG

ICO-422-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-ZAGG

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-322-ZAGG

ICA-322-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-ZAGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-648-ZWTT

ICA-648-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZWTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
48-6501-20

48-6501-20

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

0 -
48-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
48-6501-30

48-6501-30

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

0 -
48-6501-30

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-6503-21

14-6503-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-6503-31

14-6503-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APH-1816-T-T

APH-1816-T-T

APH-1816-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1916-T-T

APH-1916-T-T

APH-1916-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1516-T-T

APH-1516-T-T

APH-1516-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0616-T-T

APH-0616-T-T

APH-0616-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0216-T-T

APH-0216-T-T

APH-0216-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0816-T-T

APH-0816-T-T

APH-0816-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1616-T-T

APH-1616-T-T

APH-1616-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0716-T-T

APH-0716-T-T

APH-0716-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1216-T-T

APH-1216-T-T

APH-1216-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0416-T-T

APH-0416-T-T

APH-0416-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
HLS-0118-G-32

HLS-0118-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0118-G-32

数据表

HLS Tube Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
30-6513-10H

30-6513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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