IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1920-T-R

APH-1920-T-R

APH-1920-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1020-T-R

APH-1020-T-R

APH-1020-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0620-T-R

APH-0620-T-R

APH-0620-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1120-T-R

APH-1120-T-R

APH-1120-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0220-T-R

APH-0220-T-R

APH-0220-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1620-T-R

APH-1620-T-R

APH-1620-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0320-T-R

APH-0320-T-R

APH-0320-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0420-T-R

APH-0420-T-R

APH-0420-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0820-T-R

APH-0820-T-R

APH-0820-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
08-3508-21

08-3508-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3508-21

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-3508-31

08-3508-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3508-31

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-83-181-15-051101

510-83-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-15-051101

数据表

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0210-G-15

HLS-0210-G-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0210-G-15

数据表

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
20-7490-10

20-7490-10

SERIES 700 ELEV STRIP LINE

Aries Electronics

0 -

-

700 Elevator Strip-Line™ - Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-71000-10

20-71000-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71000-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-71056-10

20-71056-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71056-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-71070-10

20-71070-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71070-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-711250-10

20-711250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-711250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-71219-10

20-71219-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71219-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-71250-10

20-71250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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