IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
0050395288

0050395288

CONN IC DIP SOCKET 28POS TINLEAD

Molex

0 -
0050395288 数据表 - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - - -
940-99-032-24-000000

940-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-032-24-000000 数据表 940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SIP1X11-011B

SIP1X11-011B

SIP1X11-011B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

0 -
SIP1X11-011B 数据表 SIP1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
AR 22-HGL-TT

AR 22-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HGL-TT 数据表 AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR22-HZL-TT

AR22-HZL-TT

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components

0 -
AR22-HZL-TT 数据表 - Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
115-83-306-41-003101

115-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
115-83-306-41-003101 数据表 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-304-41-001101

116-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-001101 数据表 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS44-Z-SM

A-CCS44-Z-SM

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

0 -
A-CCS44-Z-SM 数据表 - Bag Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
HLS-0201-T-2

HLS-0201-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0201-T-2 数据表 HLS Tube Active SIP 2 (2 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
940-99-044-24-000000

940-99-044-24-000000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-044-24-000000 数据表 940 Tube Obsolete PLCC 44 (4 x 11) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-99-020-17-400000

940-99-020-17-400000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-020-17-400000 数据表 940 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AJ 24-LC

AJ 24-LC

SOCKET

Assmann WSW Components

0 -
AJ 24-LC 数据表 - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
123-83-304-41-001101

123-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
123-83-304-41-001101 数据表 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP318-011B

DIP318-011B

DIP318-011B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

0 -
DIP318-011B 数据表 - Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-10T 数据表 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP1X09-001B

SIP1X09-001B

SIP1X09-001B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

0 -
SIP1X09-001B 数据表 SIP1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X07-157B

SIP050-1X07-157B

1X07-157B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X07-157B 数据表 SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X13-011B

SIP1X13-011B

SIP1X13-011B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP1X13-011B 数据表 SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X06-160B

SIP050-1X06-160B

1X06-160B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X06-160B 数据表 SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR20-HZL-TT

AR20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

0 -
AR20-HZL-TT 数据表 - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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