IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-308-AGG

ICA-308-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-AGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
14-6503-20

14-6503-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6503-30

14-6503-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-324-WTT-2

ICA-324-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-WTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
3-1571586-2

3-1571586-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
3-1571586-2

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
20-1518-11H

20-1518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-320-SGG

ICO-320-SGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-SGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-320-ZLGT

ICO-320-ZLGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-ZLGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICF-628-F-O

ICF-628-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-F-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-628-F-I

ICF-628-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-F-I

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-328-F-O

ICF-328-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-F-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-328-S-I-TR

ICF-328-S-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-S-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
16-823-90T

16-823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
16-823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
510-87-175-15-061101

510-87-175-15-061101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-87-175-15-061101

数据表

510 Bulk Active PGA 175 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-642-41-002101

116-83-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
116-83-642-41-002101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-172-16-001101

510-87-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip

0 -
510-87-172-16-001101

数据表

510 Bulk Active PGA 172 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-652-41-006101

116-83-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-83-652-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-008101

116-87-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-008101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PGA101H012B1-1321R

PGA101H012B1-1321R

PGA SOCKET 101 CTS

Amphenol ICC (FCI)

0 -

-

- - Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
612-87-964-41-001101

612-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
612-87-964-41-001101

数据表

612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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