IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-83-650-41-018101

116-83-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-6513-11

30-6513-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-6518-111

24-6518-111

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-111

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-640-T-I

ICF-640-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-T-I

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
614-87-044-08-031112

614-87-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip

0 -
614-87-044-08-031112

数据表

614 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0207-G-22

HLS-0207-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0207-G-22

数据表

HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
614-93-328-31-012000

614-93-328-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-328-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-120-41-013000

346-93-120-41-013000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-120-41-013000

数据表

346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-120-41-013000

346-43-120-41-013000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-120-41-013000

数据表

346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-83-648-41-003101

116-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-83-648-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-8950-310C

06-8950-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-8950-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
XR2A-2801-N

XR2A-2801-N

CONN IC DIP SOCKET 28POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-2801-N

数据表

XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
510-83-096-11-041101

510-83-096-11-041101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

0 -
510-83-096-11-041101

数据表

510 Bulk Active PGA 96 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0511-10

18-0511-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-0511-10

数据表

511 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6823-90T

14-6823-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

0 -
14-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
510-87-175-16-001101

510-87-175-16-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-87-175-16-001101

数据表

510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-175-16-071101

510-87-175-16-071101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-87-175-16-071101

数据表

510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-175-16-072101

510-87-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-87-175-16-072101

数据表

510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8058-1G24

8058-1G24

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
8058-1G24

数据表

8058 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
24-6518-101

24-6518-101

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-101

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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