IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-13-310-41-001000

110-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

956 -
110-13-310-41-001000 数据表 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-13-640-41-001000

210-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,135 -
210-13-640-41-001000 数据表 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-324-11-001000

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

176 -
299-43-324-11-001000 数据表 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1674770-7

1674770-7

HARD TRAY ASSY MPGA479M W/TAPE

TE Connectivity AMP Connectors

6,240 -
1674770-7 数据表 - Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

12,441 -
02-0518-10 数据表 518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
346-43-101-41-013000

346-43-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.

1,753 -
346-43-101-41-013000 数据表 346 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
211-1-06-003

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

7,352 -
211-1-06-003 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
211-1-08-003

211-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

5,172 -
211-1-08-003 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
346-93-102-41-013000

346-93-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

7,718 -
346-93-102-41-013000 数据表 346 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-102-41-013000

346-43-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

1,776 -
346-43-102-41-013000 数据表 346 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1814655-1

1-1814655-1

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors

5,195 -
1-1814655-1 数据表 - Bulk Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
211-1-14-003

211-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

2,465 -
211-1-14-003 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
714-43-102-31-018000

714-43-102-31-018000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

1,956 -
714-43-102-31-018000 数据表 714 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-103-41-013000

346-43-103-41-013000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

962 -
346-43-103-41-013000 数据表 346 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-103-41-013000

346-93-103-41-013000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

436 -
346-93-103-41-013000 数据表 346 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
211-1-16-003

211-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

2,618 -
211-1-16-003 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
508-AG11D-LF

508-AG11D-LF

IC Socket, DIP8, 8 Contact(s), 2

TE Connectivity

6,542 -
508-AG11D-LF 数据表 * Tube Obsolete - - - - - - - - - - - - - - -
714-43-103-31-018000

714-43-103-31-018000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

1,358 -
714-43-103-31-018000 数据表 714 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-87-322-41-001101

110-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,247 -
110-87-322-41-001101 数据表 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-93-104-41-013000

346-93-104-41-013000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

597 -
346-93-104-41-013000 数据表 346 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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