IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
123-43-624-41-801000

123-43-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

167 -
123-43-624-41-801000 数据表 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1437504-2

3-1437504-2

3-1437504-2

TE Connectivity AMP Connectors

130 -
3-1437504-2 数据表 8080 Box Active Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Phenolic -55°C ~ 125°C
117-43-668-41-005000

117-43-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

198 -
117-43-668-41-005000 数据表 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
101-93-422-41-560000

101-93-422-41-560000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

486 -
101-93-422-41-560000 数据表 101 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-420-41-001000

110-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

538 -
110-93-420-41-001000 数据表 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

300 -
299-43-632-10-002000 数据表 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-424-41-003000

115-43-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

488 -
115-43-424-41-003000 数据表 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-318-41-007000

116-93-318-41-007000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

892 -
116-93-318-41-007000 数据表 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-628-41-005000

117-93-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

193 -
117-93-628-41-005000 数据表 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ASPI0002-P001A

ASPI0002-P001A

SPI 8Pin WSON 8X6

LOTES

3,430 -
ASPI0002-P001A 数据表 - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold Flash Phosphor Bronze Liquid Crystal Polymer (LCP) -
ASPI0001-P001A

ASPI0001-P001A

SPI 8 PIN_IC 150mil

LOTES

1,710 -
ASPI0001-P001A 数据表 - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
ACA-SPI-004-K01

ACA-SPI-004-K01

SPI 8 PIN_IC 208mil

LOTES

1,660 -
ACA-SPI-004-K01 数据表 - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
123-43-422-41-001000

123-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

165 -
123-43-422-41-001000 数据表 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-306-10-001000

299-93-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

543 -
299-93-306-10-001000 数据表 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-424-41-001000

123-43-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

300 -
123-43-424-41-001000 数据表 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-420-41-001000

612-11-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

223 -
612-11-420-41-001000 数据表 612 Tube Active DIP, 0.1" (2.54mm) Row Spacing - 0.039" (1.00mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.039" (1.00mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-320-41-801000

123-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

104 -
123-93-320-41-801000 数据表 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-318-41-801000

123-43-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

239 -
123-43-318-41-801000 数据表 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-318-11-001000

299-43-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

197 -
299-43-318-11-001000 数据表 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-324-11-001000

299-93-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

157 -
299-93-324-11-001000 数据表 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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