IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
210-43-308-41-001

210-43-308-41-001

IC SOCKET 8-PIN .100" X .300" MA

Mill-Max Manufacturing Corp.

779 -
210-43-308-41-001 数据表 210 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1814655-5

1-1814655-5

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

4,391 -
1-1814655-5 数据表 - Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
211-1-20-003

211-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

216 -
211-1-20-003 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
346-93-105-41-013000

346-93-105-41-013000

CONN SOCKET SIP 5POS GOLD

Mill-Max Manufacturing Corp.

261 -
346-93-105-41-013000 数据表 346 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2-1571552-6

2-1571552-6

820-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

1,260 -
2-1571552-6 数据表 * Tube Active - - - - - - - - - - - - - - -
714-43-104-31-018000

714-43-104-31-018000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

1,096 -
714-43-104-31-018000 数据表 714 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
211-1-24-006

211-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

785 -
211-1-24-006 数据表 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
7-1437529-9

7-1437529-9

7-1437529-9

TE Connectivity

1,462 -
7-1437529-9 数据表 500 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester -55°C ~ 125°C
2-641615-2

2-641615-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

535 -
2-641615-2 数据表 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
211-1-28-006

211-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

281 -
211-1-28-006 数据表 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
346-93-106-41-013000

346-93-106-41-013000

CONN SOCKET SIP 6POS GOLD

Mill-Max Manufacturing Corp.

162 -
346-93-106-41-013000 数据表 346 Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-318-41-003000

115-47-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

182 -
115-47-318-41-003000 数据表 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
50951-0084N-001

50951-0084N-001

1.27MM SPI ROM SOCKET CONN SMT S

Aces Connectors

955 -
50951-0084N-001 数据表 50951 Cut Tape (CT) Active SIP 8 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Thermoplastic -
50960-0084N-001

50960-0084N-001

1.27MM PITCH SPI FLASH SOCKET CO

Aces Connectors

689 -
50960-0084N-001 数据表 50960 Cut Tape (CT) Active SIP 8 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Thermoplastic -
91960-0084N

91960-0084N

8P, 1.27MM PSI FLASH SOCKET, SMT

Aces Connectors

677 -
91960-0084N 数据表 91960 Cut Tape (CT) Active DIP, ZIF (ZIP) 8 0.050" (1.27mm) Tin 50.0µin (1.27µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 50.0µin (1.27µm) Copper Alloy Thermoplastic -40°C ~ 85°C
AR 16-HZL/07-TT

AR 16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

1,391 -
AR 16-HZL/07-TT 数据表 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
50950-0084N-002

50950-0084N-002

1.27MM PITCH WINBOND SOCKET CONN

Aces Connectors

775 -
50950-0084N-002 数据表 50950 Cut Tape (CT) Active PLCC 8 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Thermoplastic -
110-83-320-41-001101

110-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

456 -
110-83-320-41-001101 数据表 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-93-109-41-013000

346-93-109-41-013000

CONN SOCKET SIP 9POS GOLD

Mill-Max Manufacturing Corp.

175 -
346-93-109-41-013000 数据表 346 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-204-31-018000

714-43-204-31-018000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

1,545 -
714-43-204-31-018000 数据表 714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
共 19086 条记录«上一页1... 3334353637383940...955下一页»
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户