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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
822516-2

822516-2

CONN SOCKET PLCC 28POS TIN

TE Connectivity AMP Connectors

0 -
822516-2

数据表

- Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
2-641267-1

2-641267-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
2-641267-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
211-1-08-003

211-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

5,172 -
211-1-08-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
346-93-102-41-013000

346-93-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

7,718 -
346-93-102-41-013000

数据表

346 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-102-41-013000

346-43-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

1,776 -
346-43-102-41-013000

数据表

346 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1814655-1

1-1814655-1

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors

5,195 -
1-1814655-1

数据表

- Bulk Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
4-1571552-2

4-1571552-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571552-2

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
211-1-14-003

211-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

2,465 -
211-1-14-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
714-43-102-31-018000

714-43-102-31-018000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.

1,956 -
714-43-102-31-018000

数据表

714 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
808-AG11D-LF

808-AG11D-LF

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
808-AG11D-LF

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
1571586-2

1571586-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
1571586-2

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
514-AG11D-ES

514-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
514-AG11D-ES

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
643642-8

643642-8

CONN SOCKET SIP 10POS TIN

TE Connectivity AMP Connectors

0 -
643642-8

数据表

Diplomate DL Tray Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
346-43-103-41-013000

346-43-103-41-013000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

962 -
346-43-103-41-013000

数据表

346 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-103-41-013000

346-93-103-41-013000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

436 -
346-93-103-41-013000

数据表

346 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
508-AG11D-ES

508-AG11D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
508-AG11D-ES

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
1-1825094-3

1-1825094-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825094-3

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
211-1-16-003

211-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

2,618 -
211-1-16-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
2-1571551-2

2-1571551-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571551-2

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2-1571550-2

2-1571550-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571550-2

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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