IC 插座
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
210-43-308-41-001IC SOCKET 8-PIN .100" X .300" MA |
779 | - |
|
|
210 | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
1-1814655-5CONN SOCKET SIP 20POS GOLD |
4,391 | - |
|
|
- | Bulk | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
|
211-1-20-003CONN IC DIP SOCKET 20POS GOLD |
216 | - |
|
|
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
346-93-105-41-013000CONN SOCKET SIP 5POS GOLD |
261 | - |
|
|
346 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
1,260 | - |
|
|
* | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
714-43-104-31-018000CONN SOCKET SIP 4POS GOLD |
1,096 | - |
|
|
714 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
211-1-24-006CONN IC DIP SOCKET 24POS GOLD |
785 | - |
|
|
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
7-1437529-97-1437529-9 |
1,462 | - |
|
|
500 | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Polyester | -55°C ~ 125°C |
|
2-641615-2CONN IC DIP SOCKET 28POS GOLD |
535 | - |
|
|
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
211-1-28-006CONN IC DIP SOCKET 28POS GOLD |
281 | - |
|
|
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
346-93-106-41-013000CONN SOCKET SIP 6POS GOLD |
162 | - |
|
|
346 | Tube | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-47-318-41-003000CONN IC DIP SOCKET 18POS GOLD |
182 | - |
|
|
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
50951-0084N-0011.27MM SPI ROM SOCKET CONN SMT S |
955 | - |
|
|
50951 | Cut Tape (CT) | Active | SIP | 8 | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Thermoplastic | - |
|
50960-0084N-0011.27MM PITCH SPI FLASH SOCKET CO |
689 | - |
|
|
50960 | Cut Tape (CT) | Active | SIP | 8 | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Thermoplastic | - |
|
91960-0084N8P, 1.27MM PSI FLASH SOCKET, SMT |
677 | - |
|
|
91960 | Cut Tape (CT) | Active | DIP, ZIF (ZIP) | 8 | 0.050" (1.27mm) | Tin | 50.0µin (1.27µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 50.0µin (1.27µm) | Copper Alloy | Thermoplastic | -40°C ~ 85°C |
|
AR 16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
1,391 | - |
|
|
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
50950-0084N-0021.27MM PITCH WINBOND SOCKET CONN |
775 | - |
|
|
50950 | Cut Tape (CT) | Active | PLCC | 8 | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Thermoplastic | - |
|
110-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
456 | - |
|
|
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
346-93-109-41-013000CONN SOCKET SIP 9POS GOLD |
175 | - |
|
|
346 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
714-43-204-31-018000CONN IC DIP SOCKET 4POS GOLD |
1,545 | - |
|
|
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |

