IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
9-1437539-1

9-1437539-1

828-AG11D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

1,245 -
9-1437539-1 数据表 800 Box Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole - Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
210-43-316-41-001

210-43-316-41-001

SOCKET 16-PIN .100" X .300" MACH

Mill-Max Manufacturing Corp.

411 -
210-43-316-41-001 数据表 210 Box Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SMPX-84LCC-P

SMPX-84LCC-P

SMT PLCC SOCKET 84P POLARISED RO

Kycon, Inc.

195 -
SMPX-84LCC-P 数据表 SMPX Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
714-43-108-31-018000

714-43-108-31-018000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

646 -
714-43-108-31-018000 数据表 714 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
524-AG11D

524-AG11D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

1,444 -
524-AG11D 数据表 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Polyester -55°C ~ 125°C
524-AG11D-ESL

524-AG11D-ESL

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

259 -
524-AG11D-ESL 数据表 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
6-1437537-6

6-1437537-6

6-1437537-6

TE Connectivity AMP Connectors

9,007 -
6-1437537-6 数据表 * Box Active - - - - - - - - - - - - - - -
346-93-116-41-013000

346-93-116-41-013000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

123 -
346-93-116-41-013000 数据表 346 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-316-41-005000

117-43-316-41-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

193 -
117-43-316-41-005000 数据表 117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-10-005000

110-43-316-10-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

249 -
110-43-316-10-005000 数据表 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1437531-5

4-1437531-5

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

192 -
4-1437531-5 数据表 500 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
7-1437536-3

7-1437536-3

540-AG10D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

4,246 -
7-1437536-3 数据表 * Tube Active - - - - - - - - - - - - - - -
614-43-324-31-012000

614-43-324-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

201 -
614-43-324-31-012000 数据表 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-306-10-001000

299-43-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

287 -
299-43-306-10-001000 数据表 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-328-10-001000

110-43-328-10-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

231 -
110-43-328-10-001000 数据表 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-328-31-012000

614-43-328-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

111 -
614-43-328-31-012000 数据表 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-328-T-O

ICF-328-T-O

SKT SMT FOR 28 PIN DIP IC

Samtec Inc.

181 -
ICF-328-T-O 数据表 ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
8080-1G1

8080-1G1

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors

183 -
8080-1G1 数据表 8080 Bulk Obsolete Transistor, TO-3 4 (Round) - Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
12-8473-310C

12-8473-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

165 -
12-8473-310C 数据表 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

380 -
8080-1G24 数据表 - Bulk Obsolete Transistor, TO-3 3 (Round) - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
共 19086 条记录«上一页1... 3435363738394041...955下一页»
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户