IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0320-T-T

APH-0320-T-T

APH-0320-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0820-T-T

APH-0820-T-T

APH-0820-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1220-T-T

APH-1220-T-T

APH-1220-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0420-T-T

APH-0420-T-T

APH-0420-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-99-304-61-001000

110-99-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-516-10

40-516-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-516-10

数据表

516 Bulk Obsolete DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
510-83-184-15-001101

510-83-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

0 -
510-83-184-15-001101

数据表

510 Bulk Active PGA 184 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-184-17-081101

510-83-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

0 -
510-83-184-17-081101

数据表

510 Bulk Active PGA 184 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0306-G-18

HLS-0306-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0306-G-18

数据表

HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
APA-318-G-A1

APA-318-G-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-318-G-A1

数据表

APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-318-G-A1

APO-318-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-G-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-308-G-R

APO-308-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-308-G-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
15-0508-21

15-0508-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0508-21

数据表

508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
15-0508-31

15-0508-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0508-31

数据表

508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
28-C182-11H

28-C182-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-C182-11H

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-83-191-18-091101

510-83-191-18-091101

CONN SOCKET PGA 191POS GOLD

Preci-Dip

0 -
510-83-191-18-091101

数据表

510 Bulk Active PGA 191 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-320-ZWGG

ICA-320-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZWGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-628-MGG

ICO-628-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-MGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
14-3503-21

14-3503-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3503-21

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-3503-31

14-3503-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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