IC 插座
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
299-43-614-10-002000CONN IC DIP SOCKET 14POS GOLD |
201 | - |
|
|
299 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-622-10-002000CONN IC DIP SOCKET 22POS GOLD |
195 | - |
|
|
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
123-43-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
179 | - |
|
|
123 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
123-43-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
145 | - |
|
|
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
6-1437562-9TT41NGRA1=SW TOGGLE 4 POLE R/A |
212 | - |
|
|
* | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
299-93-636-10-002000CONN IC DIP SOCKET 36POS GOLD |
183 | - |
|
|
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
523-93-121-13-061001PGA SOCK 121PIN 13X13 WIRE WRAP |
295 | - |
|
|
523 | Bulk | Active | PGA | 121 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
21218NECONN IC DIP SOCKET 8POS |
2,268 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212014NECONN IC DIP SOCKET 14POS |
1,214 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
212016NECONN IC DIP SOCKET 16POS |
1,364 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
212024WECONN IC DIP SOCKET 24POS |
1,892 | - |
|
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
212114NECONN IC DIP SOCKET 14POS |
1,559 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212116NECONN IC DIP SOCKET 16POS |
1,764 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212124NECONN IC DIP SOCKET 24POS |
489 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212128NECONN IC DIP SOCKET 28POS |
1,023 | - |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212132WECONN IC DIP SOCKET 32POS |
575 | - |
|
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
212140WECONN IC DIP SOCKET 40POS |
216 | - |
|
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
2,010 | - |
|
|
800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
820-AG11D-ESL-LFIC SOCKET, DIP20, 20 CONTACT(S), |
2,010 | - |
|
|
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
3-1571552-2840-AG11D-ESL-LF=800 DIP GF/SN |
5,833 | - |
|
|
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |

